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  • PCB词汇中英文对照
    发布时间:2010-4-21

    一、综合词汇

    1、印制电路:printed circuit
    2、印制线路:printed wiring
    3、印制板:printed board
    4、印制板电路:printed circuit board (PCB)
    5、印制线路板:printed wiring board(PWB)
    6、印制元件:printed component
    7、印制接点:printed contact
    8、印制板装配:printed board assembly
    9、板:board
    10、单面印制板:single-sided printed board(SSB)
    11、双面印制板:double-sided printed board(DSB)
    12、多层印制板:mulitlayer printed board(MLB)
    13、多层印制电路板:mulitlayer printed circuit board
    14、多层印制线路板:mulitlayer prited wiring board
    15、刚性印制板:rigid printed board
    16、刚性单面印制板:rigid single-sided printed borad
    17、刚性双面印制板:rigid double-sided printed borad
    18、刚性多层印制板:rigid multilayer printed board
    19、挠性多层印制板:flexible multilayer printed board
    20、挠性印制板:flexible printed board
    21、挠性单面印制板:flexible single-sided printed board
    22、挠性双面印制板:flexible double-sided printed board
    23、挠性印制电路:flexible printed circuit (FPC)
    24、挠性印制线路:flexible printed wiring
    25、刚性印制板:flex-rigid printed board, rigid-flex printed board
    26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
    27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
    28、齐平印制板:flush printed board
    29、金属芯印制板:metal core printed board
    30、金属基印制板:metal base printed board
    31、多重布线印制板:mulit-wiring printed board
    32、陶瓷印制板:ceramic substrate printed board
    33、导电胶印制板:electroconductive paste printed board
    34、模塑电路板:molded circuit board
    35、模压印制板:stamped printed wiring board
    36、顺序层压多层印制板:sequentially-laminated mulitlayer
    37、散线印制板:discrete wiring board
    38、微线印制板:micro wire board
    39、积层印制板:buile-up printed board
    40、积层多层印制板:build-up mulitlayer printed board (BUM)
    41、积层挠印制板:build-up flexible printed board
    42、表面层合电路板:surface laminar circuit (SLC)
    43、埋入凸块连印制板:B2it printed board
    44、多层膜基板:multi-layered film substrate(MFS)
    45、层间全内导通多层印制板:ALIVH multilayer printed board
    46、载芯片板:chip on board (COB)
    47、埋电阻板:buried resistance board
    48、母板:mother board
    49、子板:daughter board
    50、背板:backplane
    51、裸板:bare board
    52、键盘板夹心板:copper-invar-copper board
    53、动态挠性板:dynamic flex board
    54、静态挠性板:static flex board
    55、可断拼板:break-away planel
    56、电缆:cable
    57、挠性扁平电缆:flexible flat cable (FFC)
    58、薄膜开关:membrane switch
    59、混合电路:hybrid circuit
    60、厚膜:thick film
    61、厚膜电路:thick film circuit
    62、薄膜:thin film
    63、薄膜混合电路:thin film hybrid circuit
    64、互连:interconnection
    65、导线:conductor trace line
    66、齐平导线:flush conductor
    67、传输线:transmission line
    68、跨交:crossover
    69、板边插头:edge-board contact
    70、增强板:stiffener
    71、基底:substrate
    72、基板面:real estate
    73、导线面:conductor side
    74、元件面:component side
    75、焊接面:solder side
    76、印制:printing
    77、网格:grid
    78、图形:pattern
    79、导电图形:conductive pattern
    80、非导电图形:non-conductive pattern
    81、字符:legend
    82、标志:mark


    二、基材:

    1、基材:base material
    2、层压板:laminate
    3、覆金属箔基材:metal-clad bade material
    4、覆铜箔层压板:copper-clad laminate (CCL)
    5、单面覆铜箔层压板:single-sided copper-clad laminate
    6、双面覆铜箔层压板:double-sided copper-clad laminate
    7、复合层压板:composite laminate
    8、薄层压板:thin laminate
    9、金属芯覆铜箔层压板:metal core copper-clad laminate
    10、金属基覆铜层压板:metal base copper-clad laminate
    11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
    12、基体材料:basis material
    13、预浸材料:prepreg
    14、粘结片:bonding sheet
    15、预浸粘结片:preimpregnated bonding sheer
    16、环氧玻璃基板:epoxy glass substrate
    17、加成法用层压板:laminate for additive process
    18、预制内层覆箔板:mass lamination panel
    19、内层芯板:core material
    20、催化板材:catalyzed board ,coated catalyzed laminate
    21、涂胶催化层压板:adhesive-coated catalyzed laminate
    22、涂胶无催层压板:adhesive-coated uncatalyzed laminate
    23、粘结层:bonding layer
    24、粘结膜:film adhesive
    25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film
    26、无支撑胶粘剂膜:unsupported adhesive film
    27、覆盖层:cover layer (cover lay)
    28、增强板材:stiffener material
    29、铜箔面:copper-clad surface
    30、去铜箔面:foil removal surface
    31、层压板面:unclad laminate surface
    32、基膜面:base film surface
    33、胶粘剂面:adhesive faec
    34、原始光洁面:plate finish
    35、粗面:matt finish
    36、纵向:length wise direction
    37、模向:cross wise direction
    38、剪切板:cut to size panel
    39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
    40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
    41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates
    42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
    43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
    44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
    45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
    46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
    47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
    48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
    49、超薄型层压板:ultra thin laminate
    50、陶瓷基覆铜箔板:ceramics base copper-clad laminates
    51、紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates

    三、基材的材料

    1、 A阶树脂:A-stage resin
    2、 B阶树脂:B-stage resin
    3、 C阶树脂:C-stage resin
    4、环氧树脂:epoxy resin
    5、酚醛树脂:phenolic resin
    6、聚酯树脂:polyester resin
    7、聚酰亚胺树脂:polyimide resin
    8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resin
    9、丙烯酸树脂:acrylic resin
    10、三聚氰胺甲醛树脂:melamine formaldehyde resin
    11、多官能环氧树脂:polyfunctional epoxy resin
    12、溴化环氧树脂:brominated epoxy resin
    13、环氧酚醛:epoxy novolac
    14、氟树脂:fluroresin
    15、硅树脂:silicone resin
    16、硅烷:silane
    17、聚合物:polymer
    18、无定形聚合物:amorphous polymer
    19、结晶现象:crystalline polamer
    20、双晶现象:dimorphism
    21、共聚物:copolymer
    22、合成树脂:synthetic
    23、热固性树脂:thermosetting resin
    24、热塑性树脂:thermoplastic resin
    25、感光性树脂:photosensitive resin
    26、环氧当量:weight per epoxy equivalent (WPE)
    27、环氧值:epoxy value
    28、双氰胺:dicyandiamide
    29、粘结剂:binder
    30、胶粘剂:adesive
    31、固化剂:curing agent
    32、阻燃剂:flame retardant
    33、遮光剂:opaquer
    34、增塑剂:plasticizers
    35、不饱和聚酯:unsatuiated polyester
    36、聚酯薄膜:polyester
    37、聚酰亚胺薄膜:polyimide film (PI)
    38、聚四氟乙烯:polytetrafluoetylene (PTFE)
    39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)
    40、增强材料:reinforcing material
    41、玻璃纤维:glass fiber
    42、 E玻璃纤维:E-glass fibre
    43、 D玻璃纤维:D-glass fibre
    44、 S玻璃纤维:S-glass fibre
    45、玻璃布:glass fabric
    46、非织布:non-woven fabric
    47、玻璃纤维垫:glass mats
    48、纱线:yarn
    49、单丝:filament
    50、绞股:strand
    51、纬纱:weft yarn
    52、经纱:warp yarn
    53、但尼尔:denier
    54、经向:warp-wise
    55、纬向:weft-wise, filling-wise
    56、织物经纬密度:thread count
    57、织物组织:weave structure
    58、平纹组织:plain structure
    59、坏布:grey fabric
    60、稀松织物:woven scrim
    61、弓纬:bow of weave
    62、断经:end missing
    63、缺纬:mis-picks
    64、纬斜:bias
    65、折痕:crease
    66、云织:waviness
    67、鱼眼:fish eye
    68、毛圈长:feather length
    69、厚薄段:mark
    70、裂缝:split
    71、捻度:twist of yarn
    72、浸润剂含量:size content
    73、浸润剂残留量:size residue
    74、处理剂含量:finish level
    75、浸润剂:size
    76、偶联剂:couplint agent
    77、处理织物:finished fabric
    78、聚酰胺纤维:polyarmide fiber
    79、聚酯纤维非织布:non-woven polyester fabric
    80、浸渍绝缘纵纸:impregnating insulation paper
    81、聚芳酰胺纤维纸:aromatic polyamide paper
    82、断裂长:breaking length
    83、吸水高度:height of capillary rise
    84、湿强度保留率:wet strength retention
    85、白度:whitenness
    86、陶瓷:ceramics
    87、导电箔:conductive foil
    88、铜箔:copper foil
    89、电解铜箔:electrodeposited copper foil (ED copper foil)
    90、压延铜箔:rolled copper foil
    91、退火铜箔:annealed copper foil
    92、压延退火铜箔:rolled annealed copper foil (RA copper foil)
    93、薄铜箔:thin copper foil
    94、涂胶铜箔:adhesive coated foil
    95、涂胶脂铜箔:resin coated copper foil (RCC)
    96、复合金属箔:composite metallic material
    97、载体箔:carrier foil
    98、殷瓦:invar
    99、箔(剖面)轮廓:foil profile
    100、光面:shiny side
    101、粗糙面:matte side
    102、处理面:treated side
    103、防锈处理:stain proofing
    104、双面处理铜箔:double treated foil

    四、设计

    1、原理图:shematic diagram
    2、逻辑图:logic diagram
    3、印制线路布设:printed wire layout
    4、布设总图:master drawing
    5、可制造性设计:design-for-manufacturability
    6、计算机辅助设计:computer-aided design.(CAD)
    7、计算机辅助制造:computer-aided manufacturing.(CAM)
    8、计算机集成制造:computer integrat manufacturing.(CIM)
    9、计算机辅助工程:computer-aided engineering.(CAE)
    10、计算机辅助测试:computer-aided test.(CAT)
    11、电子设计自动化:electric design automation .(EDA)
    12、工程设计自动化:engineering design automaton .(EDA2)
    13、组装设计自动化:assembly aided architectural design. (AAAD)
    14、计算机辅助制图:computer aided drawing
    15、计算机控制显示:computer controlled display .(CCD)
    16、布局:placement
    17、布线:routing
    18、布图设计:layout
    19、重布:rerouting
    20、模拟:simulation
    21、逻辑模拟:logic simulation
    22、电路模拟:circit simulation
    23、时序模拟:timing simulation
    24、模块化:modularization
    25、布线完成率:layout effeciency
    26、机器描述格式:machine descriptionm format .(MDF)
    27、机器描述格式数据库:MDF databse
    28、设计数据库:design database
    29、设计原点:design origin
    30、优化(设计):optimization (design)
    31、供设计优化坐标轴:predominant axis
    32、表格原点:table origin
    33、镜像:mirroring
    34、驱动文件:drive file
    35、中间文件:intermediate file
    36、制造文件:manufacturing documentation
    37、队列支撑数据库:queue support database
    38、元件安置:component positioning
    39、图形显示:graphics dispaly
    40、比例因子:scaling factor
    41、扫描填充:scan filling
    42、矩形填充:rectangle filling
    43、填充域:region filling
    44、实体设计:physical design
    45、逻辑设计:logic design
    46、逻辑电路:logic circuit
    47、层次设计:hierarchical design
    48、自顶向下设计:top-down design
    49、自底向上设计:bottom-up design
    50、线网:net
    51、数字化:digitzing
    52、设计规则检查:design rule checking
    53、走(布)线器:router (CAD)
    54、网络表:net List
    55、计算机辅助电路分析:computer-aided circuit analysis
    56、子线网:subnet
    57、目标函数:objective function
    58、设计后处理:post design processing (PDP)
    59、交互式制图设计:interactive drawing design
    60、费用矩阵:cost metrix
    61、工程图:engineering drawing
    62、方块框图:block diagram
    63、迷宫:moze
    64、元件密度:component density
    65、巡回售货员问题:traveling salesman problem
    66、自由度:degrees freedom
    67、入度:out going degree
    68、出度:incoming degree
    69、曼哈顿距离:manhatton distance
    70、欧几里德距离:euclidean distance
    71、网络:network
    72、阵列:array
    73、段:segment
    74、逻辑:logic
    75、逻辑设计自动化:logic design automation
    76、分线:separated time
    77、分层:separated layer
    78、定顺序:definite sequence

    五、形状与尺寸:

    1、导线(通道):conduction (track)
    2、导线(体)宽度:conductor width
    3、导线距离:conductor spacing
    4、导线层:conductor layer
    5、导线宽度/间距:conductor line/space
    6、第一导线层:conductor layer No.1
    7、圆形盘:round pad
    8、方形盘:square pad
    9、菱形盘:diamond pad
    10、长方形焊盘:oblong pad
    11、子弹形盘:bullet pad
    12、泪滴盘:teardrop pad
    13、雪人盘:snowman pad
    14、 V形盘:V-shaped pad
    15、环形盘:annular pad
    16、非圆形盘:non-circular pad
    17、隔离盘:isolation pad
    18、非功能连接盘:monfunctional pad
    19、偏置连接盘:offset land
    20、腹(背)裸盘:back-bard land
    21、盘址:anchoring spaur
    22、连接盘图形:land pattern
    23、连接盘网格阵列:land grid array
    24、孔环:annular ring
    25、元件孔:component hole
    26、安装孔:mounting hole
    27、支撑孔:supported hole
    28、非支撑孔:unsupported hole
    29、导通孔:via
    30、镀通孔:plated through hole (PTH)
    31、余隙孔:access hole
    32、盲孔:blind via (hole)
    33、埋孔:buried via hole
    34、埋/盲孔:buried /blind via
    35、任意层内部导通孔:any layer inner via hole (ALIVH)
    36、全部钻孔:all drilled hole
    37、定位孔:toaling hole
    38、无连接盘孔:landless hole
    39、中间孔:interstitial hole
    40、无连接盘导通孔:landless via hole
    41、引导孔:pilot hole
    42、端接全隙孔:terminal clearomee hole
    43、准表面间镀覆孔:quasi-interfacing plated-through hole
    44、准尺寸孔:dimensioned hole
    45、在连接盘中导通孔:via-in-pad
    46、孔位:hole location
    47、孔密度:hole density
    48、孔图:hole pattern
    49、钻孔图:drill drawing
    50、装配图:assembly drawing
    51、印制板组装图:printed board assembly drawing
    52、参考基准:datum referance
    54、基准尺寸:reference dimension
    55、参考尺寸:reaerence dimension
    56、直接量定尺寸:direct dimensioning
    57、基准图:datum feature
    58、基准边:reference edge
    59、导线设计距离:design space of conductor
    60、导线设计宽度:design width of conductor
    61、中心距:center to center spacing
    62、线宽/间距:conductor width/space
    63、节距:pitch
    64、精细节距:fine pitch
    65、层:layer
    66、层间距:layer-to-layer spacing
    67、边距:edge spacing
    68、外形线:trim line
    69、截面积:crossection area
    70、真实值表测量:truth table test
    71、准确位置:true position tolerance
    72、精确位置:accuracy
    73、精确位置误差:cumulative tolerance
    74、精确度:accuracy
    75、累积误差:cumulative tolerance
    76、焊垫:footprint
    77、外层:external layer
    78、内层:internal layer
    79、接地层:ground plane
    80、接地层隔离:ground plane clearance
    81、电压层:voltage plane
    82、电源层隔离:voltage plane clearance
    83、电源层:power plane, bus plane
    84、导通网络:basic grid
    85、导通网格:track grid
    86、导通孔网格:via grid
    87、连通盘网格:pad (land) grid
    88、定位偏差:positional tolerance
    89、对准靶标:bornb sight
    90、梳状图形:comb pattern
    91、对准标记:register mark
    92、散热层:heat sink plane

    六、电气互连

    1、表面间连接:interlayer connection
    2、层间连接:interlayer connection
    3、内层连接:innerlayer connection
    4、非功能表面连接:nonfunctional interfacial connection
    5、跨接线:jumper wire
    6、节(交)点:node
    7、附加线:haywire
    8、端接(点):terminal
    9、连接线:terminated line
    10、端接:termination
    11、连接端:pad, land
    12、贯穿连接:through connection
    13、支线:stub
    14、印制插头:tab
    15、键槽:keying slot
    16、连接器:connector
    17、板边连接器:edge board connector
    18、连接器区:connector area
    19、直角板边连接器:right angle edge connector
    20、偏槽口:polarizing slot
    21、偏置端接区:offset terminal area
    22、接地:ground
    23、端接隔离(空环):terminal clearance
    24、连通性:continuity
    25、连接器接触:connector contact
    26、接触面积:contact area
    27、接触间距:contact spacing
    28、接触电阻:contact resistance
    29、接触尺寸:contact size
    30、元件引腿(脚):component lead
    31、元件插针:component pin
    32、最小电气间距:minimum electrical spacing
    33、导电性:conductivity
    34、边卡连接器:card-edge connector
    35、插卡连接器:card-insertion connector
    36、载流量:current-carrying capacity
    37、蹯径:path
    38、最短路径:shortest path
    39、关键路径:critical path
    40、倒角:miter
    41、串推:daisy chain
    42、斯坦纳树:steiner tree
    43、最小生成树:minimum spanning tree (MST)
    44、瓶颈宽度:necked width
    45、短叉长度:spur length
    46、短柱长度:stub length
    47、曼哈顿路径:manhattan path
    48、连接度(性):connectivity

    七、其它

    1、主面:primary side
    2、辅面:secondary side
    3、支撑面:supporting plane
    4、信号:signal
    5、信号导线:signal conductor
    6、信号地线:signal ground
    7、信号速率:signal rate
    8、信号标准化:signal standardization
    9、信号层:signal layer
    10、寄生信号:spurious signal
    11、串扰:crosstalk
    12、电容:capacitance
    13、电容耦合:capacitive coupling
    14、电磁干扰:electromagnetic interference
    15、电磁屏蔽:electromangetic shielding
    16、噪音:noise
    17、电磁兼容性:electromagnetic compatbility
    18、特性阻抗:impedance
    19、阻抗匹配:impedance match
    20、电感:inductance
    21、延迟:delay
    22、微带线:microstrip
    23、带状线:stripline
    24、探测点:probe point
    25、开窗口:cross hatching
    26、跨距:span
    27、共面性(度):coplanarity
    28、埋入电阻:buried resistance
    29、黄金板:golden board
    30、芯板:core board
    31、薄基芯:thin core
    32、非均衡传输线:unbalanced transmission line
    33、阀值:threshold
    34、极限值:threshold limit value(TLV)
    35、散热层:heat sink plane
    36、热隔离:heat sink plane
    37、导通孔堵塞:via filiing
    38、波动:surge
    39、卡板:card
    40、卡板盒/卡板柜:card cages/card racks
    41、薄型多层板:thin type multilayer board
    42、埋/盲孔多层板:
    43、模块:module
    44、单芯片模块:single chip module (SCM)
    45、多芯片模块:multichip module (MCM)
    46、多芯片模块层压基板:laminate substrate version of multichip module (MCM-L)
    47、多芯片模块陶瓷基数板:ceramic substrate version o fmultichip module (MCM-C)
    48、多芯片模块薄膜基板:deposition thin film substrate version of multilayer module (MCM-D)
    49、嵌入凸块互连技术:buried bump interconnection technology (B2 it)
    50、自动测试技术:automatic test equipment (ATE)
    51、芯板导通孔堵塞:core board viafilling
    52、对准标记:alignment mark
    53、基准标记:fiducial mark
    54、拐角标记:corner mark
    55、剪切标记:crop mark
    56、铣切标记:routing mark
    57、对位标记:registration mark
    58、缩减标记:reduvtion mark
    59、层间重合度:layer to layer registration
    60、狗骨结构:dog hone
    61、热设计:thermal design
    62、热阻:thermal resistance

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